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    Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004::page 41010
    Author:
    Ken-ichi Ohguchi
    ,
    Katsuhiko Sasaki
    DOI: 10.1115/1.4002911
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The fatigue life of a material varies with the strain rate if it has time-dependent deformation. An interesting phenomenon related to the effect of the strain rate on the fatigue life can be observed when a cyclic tension-compression loading of which strain rate in the tensile region is different from that in the compressive region is employed for the fatigue test. Different fatigue lives due to different strain rates in the tensile and compression regions originate from the difference of development behaviors of creep strain generated in the cyclic loading. This paper investigates the effects of creep strain on the difference of fatigue life due to the different strain rate in the tensile and compression regions. The creep strain of the lead-free solder Sn–3.0Ag–0.5Cu subjected to a cyclic loading was investigated using stepped ramp wave loading. The experimental results reveal that the creep strain develops differently in the tensile and compression regions. A new parameter is proposed for estimating fatigue life when the strain rate varies in the loading direction.
    keyword(s): Creep , Fatigue life , Lead-free solders , Compression , Waves , Fatigue , Tension AND Fatigue testing ,
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      Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

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    http://yetl.yabesh.ir/yetl1/handle/yetl/142932
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    contributor authorKen-ichi Ohguchi
    contributor authorKatsuhiko Sasaki
    date accessioned2017-05-09T00:37:11Z
    date available2017-05-09T00:37:11Z
    date copyrightDecember, 2010
    date issued2010
    identifier issn1528-9044
    identifier otherJEPAE4-26309#041010_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142932
    description abstractThe fatigue life of a material varies with the strain rate if it has time-dependent deformation. An interesting phenomenon related to the effect of the strain rate on the fatigue life can be observed when a cyclic tension-compression loading of which strain rate in the tensile region is different from that in the compressive region is employed for the fatigue test. Different fatigue lives due to different strain rates in the tensile and compression regions originate from the difference of development behaviors of creep strain generated in the cyclic loading. This paper investigates the effects of creep strain on the difference of fatigue life due to the different strain rate in the tensile and compression regions. The creep strain of the lead-free solder Sn–3.0Ag–0.5Cu subjected to a cyclic loading was investigated using stepped ramp wave loading. The experimental results reveal that the creep strain develops differently in the tensile and compression regions. A new parameter is proposed for estimating fatigue life when the strain rate varies in the loading direction.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleInvestigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
    typeJournal Paper
    journal volume132
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4002911
    journal fristpage41010
    identifier eissn1043-7398
    keywordsCreep
    keywordsFatigue life
    keywordsLead-free solders
    keywordsCompression
    keywordsWaves
    keywordsFatigue
    keywordsTension AND Fatigue testing
    treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004
    contenttypeFulltext
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