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contributor authorKen-ichi Ohguchi
contributor authorKatsuhiko Sasaki
date accessioned2017-05-09T00:37:11Z
date available2017-05-09T00:37:11Z
date copyrightDecember, 2010
date issued2010
identifier issn1528-9044
identifier otherJEPAE4-26309#041010_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142932
description abstractThe fatigue life of a material varies with the strain rate if it has time-dependent deformation. An interesting phenomenon related to the effect of the strain rate on the fatigue life can be observed when a cyclic tension-compression loading of which strain rate in the tensile region is different from that in the compressive region is employed for the fatigue test. Different fatigue lives due to different strain rates in the tensile and compression regions originate from the difference of development behaviors of creep strain generated in the cyclic loading. This paper investigates the effects of creep strain on the difference of fatigue life due to the different strain rate in the tensile and compression regions. The creep strain of the lead-free solder Sn–3.0Ag–0.5Cu subjected to a cyclic loading was investigated using stepped ramp wave loading. The experimental results reveal that the creep strain develops differently in the tensile and compression regions. A new parameter is proposed for estimating fatigue life when the strain rate varies in the loading direction.
publisherThe American Society of Mechanical Engineers (ASME)
titleInvestigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
typeJournal Paper
journal volume132
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4002911
journal fristpage41010
identifier eissn1043-7398
keywordsCreep
keywordsFatigue life
keywordsLead-free solders
keywordsCompression
keywordsWaves
keywordsFatigue
keywordsTension AND Fatigue testing
treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004
contenttypeFulltext


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