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    Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

    Source: Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004::page 41003
    Author:
    Ken-ichi Ohguchi
    ,
    Katsuhiko Sasaki
    DOI: 10.1115/1.4002897
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We previously proposed an elastic-plastic-creep model to estimate the fatigue strength of lead-free solder joints subjected to cyclic thermal loading. The proposed model requires detailed experimental data regarding the time-independent plastic strain and the time-dependent creep strain during cyclic thermal loading. This paper proposes an experimental method for determining the characteristics of both the plastic and creep strains generated during cyclic loading that employs stepped ramp waves. This method is applied to cyclic tension-compression loadings using a Sn–3.0Ag–0.5Cu lead-free solder for several loading conditions. The method can separate between the time-independent plastic strain and the time-dependent creep strain in cyclic inelastic deformation of solder alloys.
    keyword(s): Deformation , Creep , Stress , Waves , Lead-free solders , Compression , Tension AND Solders ,
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      Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/142925
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    contributor authorKen-ichi Ohguchi
    contributor authorKatsuhiko Sasaki
    date accessioned2017-05-09T00:37:11Z
    date available2017-05-09T00:37:11Z
    date copyrightDecember, 2010
    date issued2010
    identifier issn1528-9044
    identifier otherJEPAE4-26309#041003_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142925
    description abstractWe previously proposed an elastic-plastic-creep model to estimate the fatigue strength of lead-free solder joints subjected to cyclic thermal loading. The proposed model requires detailed experimental data regarding the time-independent plastic strain and the time-dependent creep strain during cyclic thermal loading. This paper proposes an experimental method for determining the characteristics of both the plastic and creep strains generated during cyclic loading that employs stepped ramp waves. This method is applied to cyclic tension-compression loadings using a Sn–3.0Ag–0.5Cu lead-free solder for several loading conditions. The method can separate between the time-independent plastic strain and the time-dependent creep strain in cyclic inelastic deformation of solder alloys.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleTime-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
    typeJournal Paper
    journal volume132
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4002897
    journal fristpage41003
    identifier eissn1043-7398
    keywordsDeformation
    keywordsCreep
    keywordsStress
    keywordsWaves
    keywordsLead-free solders
    keywordsCompression
    keywordsTension AND Solders
    treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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