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contributor authorKen-ichi Ohguchi
contributor authorKatsuhiko Sasaki
date accessioned2017-05-09T00:37:11Z
date available2017-05-09T00:37:11Z
date copyrightDecember, 2010
date issued2010
identifier issn1528-9044
identifier otherJEPAE4-26309#041003_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142925
description abstractWe previously proposed an elastic-plastic-creep model to estimate the fatigue strength of lead-free solder joints subjected to cyclic thermal loading. The proposed model requires detailed experimental data regarding the time-independent plastic strain and the time-dependent creep strain during cyclic thermal loading. This paper proposes an experimental method for determining the characteristics of both the plastic and creep strains generated during cyclic loading that employs stepped ramp waves. This method is applied to cyclic tension-compression loadings using a Sn–3.0Ag–0.5Cu lead-free solder for several loading conditions. The method can separate between the time-independent plastic strain and the time-dependent creep strain in cyclic inelastic deformation of solder alloys.
publisherThe American Society of Mechanical Engineers (ASME)
titleTime-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
typeJournal Paper
journal volume132
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4002897
journal fristpage41003
identifier eissn1043-7398
keywordsDeformation
keywordsCreep
keywordsStress
keywordsWaves
keywordsLead-free solders
keywordsCompression
keywordsTension AND Solders
treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004
contenttypeFulltext


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