| contributor author | Ken-ichi Ohguchi | |
| contributor author | Katsuhiko Sasaki | |
| date accessioned | 2017-05-09T00:37:11Z | |
| date available | 2017-05-09T00:37:11Z | |
| date copyright | December, 2010 | |
| date issued | 2010 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26309#041003_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/142925 | |
| description abstract | We previously proposed an elastic-plastic-creep model to estimate the fatigue strength of lead-free solder joints subjected to cyclic thermal loading. The proposed model requires detailed experimental data regarding the time-independent plastic strain and the time-dependent creep strain during cyclic thermal loading. This paper proposes an experimental method for determining the characteristics of both the plastic and creep strains generated during cyclic loading that employs stepped ramp waves. This method is applied to cyclic tension-compression loadings using a Sn–3.0Ag–0.5Cu lead-free solder for several loading conditions. The method can separate between the time-independent plastic strain and the time-dependent creep strain in cyclic inelastic deformation of solder alloys. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves | |
| type | Journal Paper | |
| journal volume | 132 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4002897 | |
| journal fristpage | 41003 | |
| identifier eissn | 1043-7398 | |
| keywords | Deformation | |
| keywords | Creep | |
| keywords | Stress | |
| keywords | Waves | |
| keywords | Lead-free solders | |
| keywords | Compression | |
| keywords | Tension AND Solders | |
| tree | Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004 | |
| contenttype | Fulltext | |
