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    Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002::page 21003
    Author:
    Ken-ichi Ohguchi
    ,
    Katsuhiko Sasaki
    ,
    Setsuo Aso
    DOI: 10.1115/1.3103951
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading, which repeats instantaneous strain and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time-dependent strains, the values of the material constants in the elasto-plastic-creep model proposed by the authors are determined. Simulations of the viscoplastic deformations of a Sn–3.0Ag–0.5Cu solder alloy are also conducted to verify the validity of the proposed method.
    keyword(s): Creep , Stress , Waves , Stress-strain relations , Lead-free solders , Deformation , Engineering simulation , Solders , Constitutive equations , Relaxation (Physics) AND Alloys ,
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      Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/140302
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    contributor authorKen-ichi Ohguchi
    contributor authorKatsuhiko Sasaki
    contributor authorSetsuo Aso
    date accessioned2017-05-09T00:32:19Z
    date available2017-05-09T00:32:19Z
    date copyrightJune, 2009
    date issued2009
    identifier issn1528-9044
    identifier otherJEPAE4-26295#021003_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/140302
    description abstractThis paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading, which repeats instantaneous strain and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time-dependent strains, the values of the material constants in the elasto-plastic-creep model proposed by the authors are determined. Simulations of the viscoplastic deformations of a Sn–3.0Ag–0.5Cu solder alloy are also conducted to verify the validity of the proposed method.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEvaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
    typeJournal Paper
    journal volume131
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3103951
    journal fristpage21003
    identifier eissn1043-7398
    keywordsCreep
    keywordsStress
    keywordsWaves
    keywordsStress-strain relations
    keywordsLead-free solders
    keywordsDeformation
    keywordsEngineering simulation
    keywordsSolders
    keywordsConstitutive equations
    keywordsRelaxation (Physics) AND Alloys
    treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002
    contenttypeFulltext
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