Show simple item record

contributor authorKen-ichi Ohguchi
contributor authorKatsuhiko Sasaki
contributor authorSetsuo Aso
date accessioned2017-05-09T00:32:19Z
date available2017-05-09T00:32:19Z
date copyrightJune, 2009
date issued2009
identifier issn1528-9044
identifier otherJEPAE4-26295#021003_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/140302
description abstractThis paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading, which repeats instantaneous strain and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time-dependent strains, the values of the material constants in the elasto-plastic-creep model proposed by the authors are determined. Simulations of the viscoplastic deformations of a Sn–3.0Ag–0.5Cu solder alloy are also conducted to verify the validity of the proposed method.
publisherThe American Society of Mechanical Engineers (ASME)
titleEvaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
typeJournal Paper
journal volume131
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.3103951
journal fristpage21003
identifier eissn1043-7398
keywordsCreep
keywordsStress
keywordsWaves
keywordsStress-strain relations
keywordsLead-free solders
keywordsDeformation
keywordsEngineering simulation
keywordsSolders
keywordsConstitutive equations
keywordsRelaxation (Physics) AND Alloys
treeJournal of Electronic Packaging:;2009:;volume( 131 ):;issue: 002
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record