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    Improved Method of CO2 Laser Cutting of Aluminum Nitride

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002::page 24501
    Author:
    Raathai Molian
    ,
    Pranav Shrotriya
    ,
    Pal Molian
    DOI: 10.1115/1.2912223
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The traditional “evaporation∕melt and blow” mechanism of CO2 laser cutting of aluminum nitride (AlN) chip carriers and heat sinks suffers from energy losses due to its high thermal conductivity, formation of dross, decomposition to aluminum, and uncontrolled thermal cracking. In order to overcome these limitations, a thermochemical method that uses a defocused laser beam to melt a thin layer of AlN surface in oxygen environment was utilized. Subsequent solidification of the melt layer generated shrinkage and thermal gradient stresses that, in turn, created a crack along the middle path of laser beam and caused material separation through unstable crack propagation. The benefits associated with thermal stress fracture method over the traditional method are improved cut quality, higher cutting speed, and lower energy losses.
    keyword(s): Aluminum , Thermal stresses , Laser cutting , Fracture (Process) , Cutting , Oxygen , Stress , Mechanisms , Energy dissipation AND Thermal conductivity ,
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      Improved Method of CO2 Laser Cutting of Aluminum Nitride

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/137776
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    contributor authorRaathai Molian
    contributor authorPranav Shrotriya
    contributor authorPal Molian
    date accessioned2017-05-09T00:27:36Z
    date available2017-05-09T00:27:36Z
    date copyrightJune, 2008
    date issued2008
    identifier issn1528-9044
    identifier otherJEPAE4-26285#024501_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137776
    description abstractThe traditional “evaporation∕melt and blow” mechanism of CO2 laser cutting of aluminum nitride (AlN) chip carriers and heat sinks suffers from energy losses due to its high thermal conductivity, formation of dross, decomposition to aluminum, and uncontrolled thermal cracking. In order to overcome these limitations, a thermochemical method that uses a defocused laser beam to melt a thin layer of AlN surface in oxygen environment was utilized. Subsequent solidification of the melt layer generated shrinkage and thermal gradient stresses that, in turn, created a crack along the middle path of laser beam and caused material separation through unstable crack propagation. The benefits associated with thermal stress fracture method over the traditional method are improved cut quality, higher cutting speed, and lower energy losses.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleImproved Method of CO2 Laser Cutting of Aluminum Nitride
    typeJournal Paper
    journal volume130
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2912223
    journal fristpage24501
    identifier eissn1043-7398
    keywordsAluminum
    keywordsThermal stresses
    keywordsLaser cutting
    keywordsFracture (Process)
    keywordsCutting
    keywordsOxygen
    keywordsStress
    keywordsMechanisms
    keywordsEnergy dissipation AND Thermal conductivity
    treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002
    contenttypeFulltext
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