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contributor authorRaathai Molian
contributor authorPranav Shrotriya
contributor authorPal Molian
date accessioned2017-05-09T00:27:36Z
date available2017-05-09T00:27:36Z
date copyrightJune, 2008
date issued2008
identifier issn1528-9044
identifier otherJEPAE4-26285#024501_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137776
description abstractThe traditional “evaporation∕melt and blow” mechanism of CO2 laser cutting of aluminum nitride (AlN) chip carriers and heat sinks suffers from energy losses due to its high thermal conductivity, formation of dross, decomposition to aluminum, and uncontrolled thermal cracking. In order to overcome these limitations, a thermochemical method that uses a defocused laser beam to melt a thin layer of AlN surface in oxygen environment was utilized. Subsequent solidification of the melt layer generated shrinkage and thermal gradient stresses that, in turn, created a crack along the middle path of laser beam and caused material separation through unstable crack propagation. The benefits associated with thermal stress fracture method over the traditional method are improved cut quality, higher cutting speed, and lower energy losses.
publisherThe American Society of Mechanical Engineers (ASME)
titleImproved Method of CO2 Laser Cutting of Aluminum Nitride
typeJournal Paper
journal volume130
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2912223
journal fristpage24501
identifier eissn1043-7398
keywordsAluminum
keywordsThermal stresses
keywordsLaser cutting
keywordsFracture (Process)
keywordsCutting
keywordsOxygen
keywordsStress
keywordsMechanisms
keywordsEnergy dissipation AND Thermal conductivity
treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002
contenttypeFulltext


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