contributor author | Cheng Lin | |
contributor author | Fangang Tseng | |
contributor author | Ching-Chang Chieng | |
date accessioned | 2017-05-09T00:27:35Z | |
date available | 2017-05-09T00:27:35Z | |
date copyright | June, 2008 | |
date issued | 2008 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26285#021005_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/137769 | |
description abstract | Conventional pick-and-place technology platform in handling microscale component assembly processes has technical limitations in terms of capacity, efficiency, and accuracy. The fluidic self-assembly (FSA) approach employs a lubricant fluid carrying micropart flows over a target wafer patterned with binding sites, which results in part-substrate attachment. This technique transports microparts from one location to another with orientation control and parallel sorting. The present study demonstrates a FSA approach for fast, economic, and precise handling of microscale parts with square (few are in rectangular) shapes. The microparts fabricated from silicon-oxide wafers and ranging in size from 350×350×170μm3to1000×1000×440μm3 aligned and filled to designated sites in the substrate under water. The effects of micropart sizes and lubricants on the FSA processes are compared. This study provides a fundamental analysis for achieving and optimizing the self-alignment. The polymer or solder adhesion force of the square-patterned micropart immobilized at the larger binding sites were estimated to be 117±15μN and 510±50μN, respectively, which results in higher assembly yield of up to 100% for these samples. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect | |
type | Journal Paper | |
journal volume | 130 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2912216 | |
journal fristpage | 21005 | |
identifier eissn | 1043-7398 | |
keywords | Force | |
keywords | Adhesives | |
keywords | Lubricants | |
keywords | Self-assembly | |
keywords | Water | |
keywords | Solders AND Manufacturing | |
tree | Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002 | |
contenttype | Fulltext | |