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    Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002::page 21005
    Author:
    Cheng Lin
    ,
    Fangang Tseng
    ,
    Ching-Chang Chieng
    DOI: 10.1115/1.2912216
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Conventional pick-and-place technology platform in handling microscale component assembly processes has technical limitations in terms of capacity, efficiency, and accuracy. The fluidic self-assembly (FSA) approach employs a lubricant fluid carrying micropart flows over a target wafer patterned with binding sites, which results in part-substrate attachment. This technique transports microparts from one location to another with orientation control and parallel sorting. The present study demonstrates a FSA approach for fast, economic, and precise handling of microscale parts with square (few are in rectangular) shapes. The microparts fabricated from silicon-oxide wafers and ranging in size from 350×350×170μm3to1000×1000×440μm3 aligned and filled to designated sites in the substrate under water. The effects of micropart sizes and lubricants on the FSA processes are compared. This study provides a fundamental analysis for achieving and optimizing the self-alignment. The polymer or solder adhesion force of the square-patterned micropart immobilized at the larger binding sites were estimated to be 117±15μN and 510±50μN, respectively, which results in higher assembly yield of up to 100% for these samples.
    keyword(s): Force , Adhesives , Lubricants , Self-assembly , Water , Solders AND Manufacturing ,
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      Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/137769
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    contributor authorCheng Lin
    contributor authorFangang Tseng
    contributor authorChing-Chang Chieng
    date accessioned2017-05-09T00:27:35Z
    date available2017-05-09T00:27:35Z
    date copyrightJune, 2008
    date issued2008
    identifier issn1528-9044
    identifier otherJEPAE4-26285#021005_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137769
    description abstractConventional pick-and-place technology platform in handling microscale component assembly processes has technical limitations in terms of capacity, efficiency, and accuracy. The fluidic self-assembly (FSA) approach employs a lubricant fluid carrying micropart flows over a target wafer patterned with binding sites, which results in part-substrate attachment. This technique transports microparts from one location to another with orientation control and parallel sorting. The present study demonstrates a FSA approach for fast, economic, and precise handling of microscale parts with square (few are in rectangular) shapes. The microparts fabricated from silicon-oxide wafers and ranging in size from 350×350×170μm3to1000×1000×440μm3 aligned and filled to designated sites in the substrate under water. The effects of micropart sizes and lubricants on the FSA processes are compared. This study provides a fundamental analysis for achieving and optimizing the self-alignment. The polymer or solder adhesion force of the square-patterned micropart immobilized at the larger binding sites were estimated to be 117±15μN and 510±50μN, respectively, which results in higher assembly yield of up to 100% for these samples.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleStudies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect
    typeJournal Paper
    journal volume130
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2912216
    journal fristpage21005
    identifier eissn1043-7398
    keywordsForce
    keywordsAdhesives
    keywordsLubricants
    keywordsSelf-assembly
    keywordsWater
    keywordsSolders AND Manufacturing
    treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian