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contributor authorCheng Lin
contributor authorFangang Tseng
contributor authorChing-Chang Chieng
date accessioned2017-05-09T00:27:35Z
date available2017-05-09T00:27:35Z
date copyrightJune, 2008
date issued2008
identifier issn1528-9044
identifier otherJEPAE4-26285#021005_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137769
description abstractConventional pick-and-place technology platform in handling microscale component assembly processes has technical limitations in terms of capacity, efficiency, and accuracy. The fluidic self-assembly (FSA) approach employs a lubricant fluid carrying micropart flows over a target wafer patterned with binding sites, which results in part-substrate attachment. This technique transports microparts from one location to another with orientation control and parallel sorting. The present study demonstrates a FSA approach for fast, economic, and precise handling of microscale parts with square (few are in rectangular) shapes. The microparts fabricated from silicon-oxide wafers and ranging in size from 350×350×170μm3to1000×1000×440μm3 aligned and filled to designated sites in the substrate under water. The effects of micropart sizes and lubricants on the FSA processes are compared. This study provides a fundamental analysis for achieving and optimizing the self-alignment. The polymer or solder adhesion force of the square-patterned micropart immobilized at the larger binding sites were estimated to be 117±15μN and 510±50μN, respectively, which results in higher assembly yield of up to 100% for these samples.
publisherThe American Society of Mechanical Engineers (ASME)
titleStudies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect
typeJournal Paper
journal volume130
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2912216
journal fristpage21005
identifier eissn1043-7398
keywordsForce
keywordsAdhesives
keywordsLubricants
keywordsSelf-assembly
keywordsWater
keywordsSolders AND Manufacturing
treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002
contenttypeFulltext


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