contributor author | Fadi Alsaleem | |
contributor author | Mohammad I. Younis | |
contributor author | Ronald Miles | |
date accessioned | 2017-05-09T00:27:33Z | |
date available | 2017-05-09T00:27:33Z | |
date copyright | September, 2008 | |
date issued | 2008 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26287#031002_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/137750 | |
description abstract | We present an investigation into the effect of the motion of a printed circuit board (PCB) on the response of a microelectromechanical system (MEMS) device to shock loads. A two-degrees-of-freedom model is used to model the motion of the PCB and the microstructure, which can be a beam or a plate. The mechanical shock is represented as a single point force impacting the PCB. The effects of the fundamental natural frequency of the PCB, damping, shock pulse duration, electrostatic force, and their interactions are investigated. It is found that neglecting the PCB effect on the modeling of MEMS under shock loads can lead to erroneous predictions of the microstructure motion. Further, contradictory to what is mentioned in literature that a PCB, as a worst-case scenario, transfers the shock pulse to the microstructure without significantly altering its shape or intensity, we show that a poor design of the PCB or the MEMS package may result in severe amplification of the shock effect. This amplification can cause early pull-in instability for MEMS devices employing electrostatic forces. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads | |
type | Journal Paper | |
journal volume | 130 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2957319 | |
journal fristpage | 31002 | |
identifier eissn | 1043-7398 | |
keywords | Stress | |
keywords | Shock (Mechanics) | |
keywords | Microelectromechanical systems | |
keywords | Motion | |
keywords | Force AND Manufacturing | |
tree | Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003 | |
contenttype | Fulltext | |