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contributor authorFadi Alsaleem
contributor authorMohammad I. Younis
contributor authorRonald Miles
date accessioned2017-05-09T00:27:33Z
date available2017-05-09T00:27:33Z
date copyrightSeptember, 2008
date issued2008
identifier issn1528-9044
identifier otherJEPAE4-26287#031002_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137750
description abstractWe present an investigation into the effect of the motion of a printed circuit board (PCB) on the response of a microelectromechanical system (MEMS) device to shock loads. A two-degrees-of-freedom model is used to model the motion of the PCB and the microstructure, which can be a beam or a plate. The mechanical shock is represented as a single point force impacting the PCB. The effects of the fundamental natural frequency of the PCB, damping, shock pulse duration, electrostatic force, and their interactions are investigated. It is found that neglecting the PCB effect on the modeling of MEMS under shock loads can lead to erroneous predictions of the microstructure motion. Further, contradictory to what is mentioned in literature that a PCB, as a worst-case scenario, transfers the shock pulse to the microstructure without significantly altering its shape or intensity, we show that a poor design of the PCB or the MEMS package may result in severe amplification of the shock effect. This amplification can cause early pull-in instability for MEMS devices employing electrostatic forces.
publisherThe American Society of Mechanical Engineers (ASME)
titleAn Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads
typeJournal Paper
journal volume130
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2957319
journal fristpage31002
identifier eissn1043-7398
keywordsStress
keywordsShock (Mechanics)
keywordsMicroelectromechanical systems
keywordsMotion
keywordsForce AND Manufacturing
treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 003
contenttypeFulltext


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