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    Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004::page 41002
    Author:
    Karl J. Geisler
    ,
    Avram Bar-Cohen
    DOI: 10.1115/1.2993135
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A finite element analysis approach is developed and used to efficiently evaluate and optimize the boiling performance of longitudinal rectangular plate fin heat sinks, including the explicit dependence of fin spacing on boiling heat transfer coefficients and on the critical heat flux (CHF). Polished silicon heat sinks are shown to dissipate at nearly five times the CHF limit of the unfinned base area and outperform comparable aluminum heat sinks by a factor of 2. For optimum heat sink geometries, over the parameter ranges explored, the fin thickness is found to be approximately equal to the fin spacing, and the relationship between the optimum thickness and spacing is demonstrated to be relatively insensitive to the fin thermal conductivity. Results suggest that even greater performance enhancements may be gained with appropriately-selected advanced materials.
    keyword(s): Heat , Aluminum , Boiling , Heat sinks , Fins , Thermal conductivity , Silicon , Critical heat flux , Energy dissipation , Heat transfer coefficients AND Thickness ,
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      Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/137733
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    • Journal of Electronic Packaging

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    contributor authorKarl J. Geisler
    contributor authorAvram Bar-Cohen
    date accessioned2017-05-09T00:27:31Z
    date available2017-05-09T00:27:31Z
    date copyrightDecember, 2008
    date issued2008
    identifier issn1528-9044
    identifier otherJEPAE4-26289#041002_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137733
    description abstractA finite element analysis approach is developed and used to efficiently evaluate and optimize the boiling performance of longitudinal rectangular plate fin heat sinks, including the explicit dependence of fin spacing on boiling heat transfer coefficients and on the critical heat flux (CHF). Polished silicon heat sinks are shown to dissipate at nearly five times the CHF limit of the unfinned base area and outperform comparable aluminum heat sinks by a factor of 2. For optimum heat sink geometries, over the parameter ranges explored, the fin thickness is found to be approximately equal to the fin spacing, and the relationship between the optimum thickness and spacing is demonstrated to be relatively insensitive to the fin thermal conductivity. Results suggest that even greater performance enhancements may be gained with appropriately-selected advanced materials.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleOptimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces
    typeJournal Paper
    journal volume130
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2993135
    journal fristpage41002
    identifier eissn1043-7398
    keywordsHeat
    keywordsAluminum
    keywordsBoiling
    keywordsHeat sinks
    keywordsFins
    keywordsThermal conductivity
    keywordsSilicon
    keywordsCritical heat flux
    keywordsEnergy dissipation
    keywordsHeat transfer coefficients AND Thickness
    treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian