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contributor authorKarl J. Geisler
contributor authorAvram Bar-Cohen
date accessioned2017-05-09T00:27:31Z
date available2017-05-09T00:27:31Z
date copyrightDecember, 2008
date issued2008
identifier issn1528-9044
identifier otherJEPAE4-26289#041002_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137733
description abstractA finite element analysis approach is developed and used to efficiently evaluate and optimize the boiling performance of longitudinal rectangular plate fin heat sinks, including the explicit dependence of fin spacing on boiling heat transfer coefficients and on the critical heat flux (CHF). Polished silicon heat sinks are shown to dissipate at nearly five times the CHF limit of the unfinned base area and outperform comparable aluminum heat sinks by a factor of 2. For optimum heat sink geometries, over the parameter ranges explored, the fin thickness is found to be approximately equal to the fin spacing, and the relationship between the optimum thickness and spacing is demonstrated to be relatively insensitive to the fin thermal conductivity. Results suggest that even greater performance enhancements may be gained with appropriately-selected advanced materials.
publisherThe American Society of Mechanical Engineers (ASME)
titleOptimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces
typeJournal Paper
journal volume130
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2993135
journal fristpage41002
identifier eissn1043-7398
keywordsHeat
keywordsAluminum
keywordsBoiling
keywordsHeat sinks
keywordsFins
keywordsThermal conductivity
keywordsSilicon
keywordsCritical heat flux
keywordsEnergy dissipation
keywordsHeat transfer coefficients AND Thickness
treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004
contenttypeFulltext


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