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    Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5Sn–3.5Ag Solder Alloy Under Cyclic Multiaxial Straining

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001::page 41
    Author:
    Xianjie Yang
    ,
    Yan Luo
    ,
    Qing Gao
    DOI: 10.1115/1.2429708
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Based on the time dependent multiaxial deformation behavior of 96.5Sn–3.5Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. In the back stress evolution equations of this model, the nonproportionality which affects the back stress evolution rate is introduced. The approach for the determination of model parameters is proposed. The model is used to describe the time-dependent cyclic deformation behavior of 96.5Sn–3.5Ag solder alloy under cross, rectangular, rhombic, and double-triangular tensile–torsion multiaxial strain paths at different strain rates with different dwell time. The comparison between the predicted and experimental results demonstrates that the model can satisfactorily describe the time-dependent multiaxial cyclic deformation behavior under complicated nonproportional cyclic straining.
    keyword(s): Deformation , Stress , Modeling , Solders AND Alloys ,
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      Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5Sn–3.5Ag Solder Alloy Under Cyclic Multiaxial Straining

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    http://yetl.yabesh.ir/yetl1/handle/yetl/135584
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    contributor authorXianjie Yang
    contributor authorYan Luo
    contributor authorQing Gao
    date accessioned2017-05-09T00:23:27Z
    date available2017-05-09T00:23:27Z
    date copyrightMarch, 2007
    date issued2007
    identifier issn1528-9044
    identifier otherJEPAE4-26272#41_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135584
    description abstractBased on the time dependent multiaxial deformation behavior of 96.5Sn–3.5Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. In the back stress evolution equations of this model, the nonproportionality which affects the back stress evolution rate is introduced. The approach for the determination of model parameters is proposed. The model is used to describe the time-dependent cyclic deformation behavior of 96.5Sn–3.5Ag solder alloy under cross, rectangular, rhombic, and double-triangular tensile–torsion multiaxial strain paths at different strain rates with different dwell time. The comparison between the predicted and experimental results demonstrates that the model can satisfactorily describe the time-dependent multiaxial cyclic deformation behavior under complicated nonproportional cyclic straining.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleConstitutive Modeling on Time-Dependent Deformation Behavior of 96.5Sn–3.5Ag Solder Alloy Under Cyclic Multiaxial Straining
    typeJournal Paper
    journal volume129
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2429708
    journal fristpage41
    journal lastpage47
    identifier eissn1043-7398
    keywordsDeformation
    keywordsStress
    keywordsModeling
    keywordsSolders AND Alloys
    treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian