| contributor author | Xianjie Yang | |
| contributor author | Yan Luo | |
| contributor author | Qing Gao | |
| date accessioned | 2017-05-09T00:23:27Z | |
| date available | 2017-05-09T00:23:27Z | |
| date copyright | March, 2007 | |
| date issued | 2007 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26272#41_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/135584 | |
| description abstract | Based on the time dependent multiaxial deformation behavior of 96.5Sn–3.5Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. In the back stress evolution equations of this model, the nonproportionality which affects the back stress evolution rate is introduced. The approach for the determination of model parameters is proposed. The model is used to describe the time-dependent cyclic deformation behavior of 96.5Sn–3.5Ag solder alloy under cross, rectangular, rhombic, and double-triangular tensile–torsion multiaxial strain paths at different strain rates with different dwell time. The comparison between the predicted and experimental results demonstrates that the model can satisfactorily describe the time-dependent multiaxial cyclic deformation behavior under complicated nonproportional cyclic straining. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Constitutive Modeling on Time-Dependent Deformation Behavior of 96.5Sn–3.5Ag Solder Alloy Under Cyclic Multiaxial Straining | |
| type | Journal Paper | |
| journal volume | 129 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2429708 | |
| journal fristpage | 41 | |
| journal lastpage | 47 | |
| identifier eissn | 1043-7398 | |
| keywords | Deformation | |
| keywords | Stress | |
| keywords | Modeling | |
| keywords | Solders AND Alloys | |
| tree | Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001 | |
| contenttype | Fulltext | |
