| contributor author | Juan Gomez | |
| contributor author | Cemal Basaran | |
| date accessioned | 2017-05-09T00:23:23Z | |
| date available | 2017-05-09T00:23:23Z | |
| date copyright | June, 2007 | |
| date issued | 2007 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26275#120_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/135563 | |
| description abstract | Strain gradient plasticity theories that have emerged during recent years to provide an explanation for size dependent behavior exhibited by some materials have also created a need for additional material parameters. In this study on Pb∕Sn solder alloys’ material length scale, which is needed for use in strain gradient plasticity type constitutive models, is determined. The value of length scale is in agreement with values available in literature for different materials like copper, nickel, and aluminum. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys | |
| type | Journal Paper | |
| journal volume | 129 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2721082 | |
| journal fristpage | 120 | |
| journal lastpage | 128 | |
| identifier eissn | 1043-7398 | |
| keywords | Alloys | |
| keywords | Solders | |
| keywords | Gradients | |
| keywords | Nanoindentation | |
| keywords | Microelectronic devices | |
| keywords | Plasticity AND Copper | |
| tree | Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 002 | |
| contenttype | Fulltext | |