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contributor authorJuan Gomez
contributor authorCemal Basaran
date accessioned2017-05-09T00:23:23Z
date available2017-05-09T00:23:23Z
date copyrightJune, 2007
date issued2007
identifier issn1528-9044
identifier otherJEPAE4-26275#120_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135563
description abstractStrain gradient plasticity theories that have emerged during recent years to provide an explanation for size dependent behavior exhibited by some materials have also created a need for additional material parameters. In this study on Pb∕Sn solder alloys’ material length scale, which is needed for use in strain gradient plasticity type constitutive models, is determined. The value of length scale is in agreement with values available in literature for different materials like copper, nickel, and aluminum.
publisherThe American Society of Mechanical Engineers (ASME)
titleDetermination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys
typeJournal Paper
journal volume129
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2721082
journal fristpage120
journal lastpage128
identifier eissn1043-7398
keywordsAlloys
keywordsSolders
keywordsGradients
keywordsNanoindentation
keywordsMicroelectronic devices
keywordsPlasticity AND Copper
treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 002
contenttypeFulltext


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