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    Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003::page 300
    Author:
    Luke M. Thompson
    ,
    Michael R. Maughan
    ,
    Karl K. Rink
    ,
    Donald M. Blackketter
    ,
    Robert R. Stephens
    DOI: 10.1115/1.2753920
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Cracks have been observed in the insulating glass of bridge-wire initiators that may allow moisture to penetrate the assembly, potentially leading to the corrosion and degradation of the bridge wire and the pyrotechnic material. Degradation of the pyrotechnic or the bridge wire may result in initiator failure or diminished performance. The goal of this research is to determine if the manufacturing processes could produce thermal stresses great enough to crack the glass. A parametric plane stress closed-form solution was used to determine the effects of changing material properties and dimensions of the initiator, and to determine potential stresses within the initiator from two different manufacturing scenarios. To verify and expand the plane stress closed-form solution, a two-dimensional axisymmetric finite element analysis was performed. To reproduce the two manufacturing scenarios, lumped models and models that included the effects of cooling the initiator were used. Both models showed that if the manufacturing process involves pouring molten glass into the initiator, the potential for cracking exists. Furthermore, if the surface of the initiator cools faster than the center, cracking is more likely.
    keyword(s): Glass , Manufacturing , Stress , Finite element analysis , Wire , Cooling , Metals AND Temperature ,
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      Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

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    http://yetl.yabesh.ir/yetl1/handle/yetl/135553
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    contributor authorLuke M. Thompson
    contributor authorMichael R. Maughan
    contributor authorKarl K. Rink
    contributor authorDonald M. Blackketter
    contributor authorRobert R. Stephens
    date accessioned2017-05-09T00:23:22Z
    date available2017-05-09T00:23:22Z
    date copyrightSeptember, 2007
    date issued2007
    identifier issn1528-9044
    identifier otherJEPAE4-26276#300_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135553
    description abstractCracks have been observed in the insulating glass of bridge-wire initiators that may allow moisture to penetrate the assembly, potentially leading to the corrosion and degradation of the bridge wire and the pyrotechnic material. Degradation of the pyrotechnic or the bridge wire may result in initiator failure or diminished performance. The goal of this research is to determine if the manufacturing processes could produce thermal stresses great enough to crack the glass. A parametric plane stress closed-form solution was used to determine the effects of changing material properties and dimensions of the initiator, and to determine potential stresses within the initiator from two different manufacturing scenarios. To verify and expand the plane stress closed-form solution, a two-dimensional axisymmetric finite element analysis was performed. To reproduce the two manufacturing scenarios, lumped models and models that included the effects of cooling the initiator were used. Both models showed that if the manufacturing process involves pouring molten glass into the initiator, the potential for cracking exists. Furthermore, if the surface of the initiator cools faster than the center, cracking is more likely.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals
    typeJournal Paper
    journal volume129
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2753920
    journal fristpage300
    journal lastpage306
    identifier eissn1043-7398
    keywordsGlass
    keywordsManufacturing
    keywordsStress
    keywordsFinite element analysis
    keywordsWire
    keywordsCooling
    keywordsMetals AND Temperature
    treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003
    contenttypeFulltext
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