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contributor authorLuke M. Thompson
contributor authorMichael R. Maughan
contributor authorKarl K. Rink
contributor authorDonald M. Blackketter
contributor authorRobert R. Stephens
date accessioned2017-05-09T00:23:22Z
date available2017-05-09T00:23:22Z
date copyrightSeptember, 2007
date issued2007
identifier issn1528-9044
identifier otherJEPAE4-26276#300_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135553
description abstractCracks have been observed in the insulating glass of bridge-wire initiators that may allow moisture to penetrate the assembly, potentially leading to the corrosion and degradation of the bridge wire and the pyrotechnic material. Degradation of the pyrotechnic or the bridge wire may result in initiator failure or diminished performance. The goal of this research is to determine if the manufacturing processes could produce thermal stresses great enough to crack the glass. A parametric plane stress closed-form solution was used to determine the effects of changing material properties and dimensions of the initiator, and to determine potential stresses within the initiator from two different manufacturing scenarios. To verify and expand the plane stress closed-form solution, a two-dimensional axisymmetric finite element analysis was performed. To reproduce the two manufacturing scenarios, lumped models and models that included the effects of cooling the initiator were used. Both models showed that if the manufacturing process involves pouring molten glass into the initiator, the potential for cracking exists. Furthermore, if the surface of the initiator cools faster than the center, cracking is more likely.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals
typeJournal Paper
journal volume129
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2753920
journal fristpage300
journal lastpage306
identifier eissn1043-7398
keywordsGlass
keywordsManufacturing
keywordsStress
keywordsFinite element analysis
keywordsWire
keywordsCooling
keywordsMetals AND Temperature
treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003
contenttypeFulltext


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