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    Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

    Source: Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003::page 221
    Author:
    D. H. Lee
    ,
    Y. S. Chung
    ,
    P. M. Ligrani
    DOI: 10.1115/1.2753884
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Fluid flow and heat transfer characteristics on and around a central pedestal and a secondary pedestal, mounted on a flat surface with an impinging jet, are investigated. Surface Nusselt numbers, pressure coefficients (in the form of normalized wall static pressure relative to freestream static pressure), and flow visualization results are given for jet Reynolds numbers of 23,000 and 2300. The dimensionless nozzle-to-surface distance L∕d is 2, and the nondimensional height of the central pedestal H∕D is 0.5. Results are given for different secondary pedestal heights and locations. Spatially averaged Nusselt numbers measured with secondary pedestals employed are 13% to 33% higher than values measured with no secondary pedestal. Local Nusselt numbers and wall pressure coefficients, measured with the secondary pedestal present, are different from values measured with no secondary pedestal, because of flow reattachment and the two counter-rotating recirculation zones located between the two pedestals, and small local regions of flow separation and recirculation located on top of the secondary pedestal. As such, the present multiple pedestal data with impinging jets are useful for a variety of electronics cooling arrangements.
    keyword(s): Pressure , Flow (Dynamics) , Flow visualization , Nozzles , Fins , Jets , Flow separation , Impingement cooling , Temperature , Flat plates , Reynolds number AND Heat transfer ,
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      Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

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    http://yetl.yabesh.ir/yetl1/handle/yetl/135541
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    • Journal of Electronic Packaging

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    contributor authorD. H. Lee
    contributor authorY. S. Chung
    contributor authorP. M. Ligrani
    date accessioned2017-05-09T00:23:20Z
    date available2017-05-09T00:23:20Z
    date copyrightSeptember, 2007
    date issued2007
    identifier issn1528-9044
    identifier otherJEPAE4-26276#221_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135541
    description abstractFluid flow and heat transfer characteristics on and around a central pedestal and a secondary pedestal, mounted on a flat surface with an impinging jet, are investigated. Surface Nusselt numbers, pressure coefficients (in the form of normalized wall static pressure relative to freestream static pressure), and flow visualization results are given for jet Reynolds numbers of 23,000 and 2300. The dimensionless nozzle-to-surface distance L∕d is 2, and the nondimensional height of the central pedestal H∕D is 0.5. Results are given for different secondary pedestal heights and locations. Spatially averaged Nusselt numbers measured with secondary pedestals employed are 13% to 33% higher than values measured with no secondary pedestal. Local Nusselt numbers and wall pressure coefficients, measured with the secondary pedestal present, are different from values measured with no secondary pedestal, because of flow reattachment and the two counter-rotating recirculation zones located between the two pedestals, and small local regions of flow separation and recirculation located on top of the secondary pedestal. As such, the present multiple pedestal data with impinging jets are useful for a variety of electronics cooling arrangements.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleJet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
    typeJournal Paper
    journal volume129
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2753884
    journal fristpage221
    journal lastpage228
    identifier eissn1043-7398
    keywordsPressure
    keywordsFlow (Dynamics)
    keywordsFlow visualization
    keywordsNozzles
    keywordsFins
    keywordsJets
    keywordsFlow separation
    keywordsImpingement cooling
    keywordsTemperature
    keywordsFlat plates
    keywordsReynolds number AND Heat transfer
    treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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