Show simple item record

contributor authorD. H. Lee
contributor authorY. S. Chung
contributor authorP. M. Ligrani
date accessioned2017-05-09T00:23:20Z
date available2017-05-09T00:23:20Z
date copyrightSeptember, 2007
date issued2007
identifier issn1528-9044
identifier otherJEPAE4-26276#221_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135541
description abstractFluid flow and heat transfer characteristics on and around a central pedestal and a secondary pedestal, mounted on a flat surface with an impinging jet, are investigated. Surface Nusselt numbers, pressure coefficients (in the form of normalized wall static pressure relative to freestream static pressure), and flow visualization results are given for jet Reynolds numbers of 23,000 and 2300. The dimensionless nozzle-to-surface distance L∕d is 2, and the nondimensional height of the central pedestal H∕D is 0.5. Results are given for different secondary pedestal heights and locations. Spatially averaged Nusselt numbers measured with secondary pedestals employed are 13% to 33% higher than values measured with no secondary pedestal. Local Nusselt numbers and wall pressure coefficients, measured with the secondary pedestal present, are different from values measured with no secondary pedestal, because of flow reattachment and the two counter-rotating recirculation zones located between the two pedestals, and small local regions of flow separation and recirculation located on top of the secondary pedestal. As such, the present multiple pedestal data with impinging jets are useful for a variety of electronics cooling arrangements.
publisherThe American Society of Mechanical Engineers (ASME)
titleJet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
typeJournal Paper
journal volume129
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2753884
journal fristpage221
journal lastpage228
identifier eissn1043-7398
keywordsPressure
keywordsFlow (Dynamics)
keywordsFlow visualization
keywordsNozzles
keywordsFins
keywordsJets
keywordsFlow separation
keywordsImpingement cooling
keywordsTemperature
keywordsFlat plates
keywordsReynolds number AND Heat transfer
treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 003
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record