contributor author | Yong Wang | |
contributor author | Guang Yuan | |
contributor author | Sue Ann Bidstrup | |
contributor author | Yong-Kyu Yoon | |
contributor author | Mark G. Allen | |
date accessioned | 2017-05-09T00:19:32Z | |
date available | 2017-05-09T00:19:32Z | |
date copyright | December, 2006 | |
date issued | 2006 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26266#353_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133497 | |
description abstract | The active cooling substrate in this study is a microelectromechanical system device that implements the synthetic jet concept into a printed wiring board (PWB) to enhance thermal management. Synthetic jets are oscillatory jets synthesized from the surrounding fluid using electromagnetic actuators. The jet fluid mechanics and heat transfer applications have been investigated by a variety of on-board (PWB) fluidic structures. A testbed comprising six different fluidic channels has been fabricated and characterized with a standard silicon based platinum heater. Based on the fluid mechanics measurements and cooling performance tests, an empirical correlation of synthetic jet Nusselt number with its Reynolds number, fluidic channel dimensions, and jet locations has been derived. Through a magnitude analysis, jet actuator diaphragm, fluidic channel dimension, and cooling location optimizations have been investigated. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards | |
type | Journal Paper | |
journal volume | 128 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2351900 | |
journal fristpage | 353 | |
journal lastpage | 359 | |
identifier eissn | 1043-7398 | |
keywords | Fluid mechanics | |
keywords | Heat transfer | |
keywords | Cooling | |
keywords | Channels (Hydraulic engineering) | |
keywords | Dimensions | |
keywords | Diaphragms (Structural) | |
keywords | Jets | |
keywords | Optimization | |
keywords | Printed circuit boards | |
keywords | Fluids | |
keywords | Heat | |
keywords | Thermal management | |
keywords | Actuators | |
keywords | Flow (Dynamics) | |
keywords | Equations AND Reynolds number | |
tree | Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004 | |
contenttype | Fulltext | |