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contributor authorYong Wang
contributor authorGuang Yuan
contributor authorSue Ann Bidstrup
contributor authorYong-Kyu Yoon
contributor authorMark G. Allen
date accessioned2017-05-09T00:19:32Z
date available2017-05-09T00:19:32Z
date copyrightDecember, 2006
date issued2006
identifier issn1528-9044
identifier otherJEPAE4-26266#353_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133497
description abstractThe active cooling substrate in this study is a microelectromechanical system device that implements the synthetic jet concept into a printed wiring board (PWB) to enhance thermal management. Synthetic jets are oscillatory jets synthesized from the surrounding fluid using electromagnetic actuators. The jet fluid mechanics and heat transfer applications have been investigated by a variety of on-board (PWB) fluidic structures. A testbed comprising six different fluidic channels has been fabricated and characterized with a standard silicon based platinum heater. Based on the fluid mechanics measurements and cooling performance tests, an empirical correlation of synthetic jet Nusselt number with its Reynolds number, fluidic channel dimensions, and jet locations has been derived. Through a magnitude analysis, jet actuator diaphragm, fluidic channel dimension, and cooling location optimizations have been investigated.
publisherThe American Society of Mechanical Engineers (ASME)
titleOptimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards
typeJournal Paper
journal volume128
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2351900
journal fristpage353
journal lastpage359
identifier eissn1043-7398
keywordsFluid mechanics
keywordsHeat transfer
keywordsCooling
keywordsChannels (Hydraulic engineering)
keywordsDimensions
keywordsDiaphragms (Structural)
keywordsJets
keywordsOptimization
keywordsPrinted circuit boards
keywordsFluids
keywordsHeat
keywordsThermal management
keywordsActuators
keywordsFlow (Dynamics)
keywordsEquations AND Reynolds number
treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
contenttypeFulltext


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