contributor author | Sandeep S. Tonapi | |
contributor author | Sanjeev B. Sathe | |
contributor author | Bahgat G. Sammakia | |
contributor author | K. Srihari | |
date accessioned | 2017-05-09T00:19:30Z | |
date available | 2017-05-09T00:19:30Z | |
date copyright | December, 2006 | |
date issued | 2006 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26266#305_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133490 | |
description abstract | This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages mounted in back-to-back and offset configurations. A cover plate is attached to the back side of the chips to enhance heat transfer from the module. The assembled organic carrier is placed in a vertical channel. A conjugate heat transfer model is used which accounts for conduction in the packages and the card and convection in the surrounding air. The effect of location of the modules on a card with zero, one and two power planes is evaluated for thermal performance. Heat dissipation is studied for forced convection (2, 1, and 0.5m∕s). Comparison is made for single sided and back-to-back cases. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages | |
type | Journal Paper | |
journal volume | 128 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2351891 | |
journal fristpage | 305 | |
journal lastpage | 310 | |
identifier eissn | 1043-7398 | |
keywords | Heat | |
keywords | Temperature | |
keywords | Heat transfer | |
keywords | Air flow | |
keywords | Energy dissipation | |
keywords | Numerical analysis | |
keywords | Ball-Grid-Array packaging | |
keywords | Forced convection | |
keywords | Junctions | |
keywords | Temperature distribution | |
keywords | Convection AND Heat conduction | |
tree | Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004 | |
contenttype | Fulltext | |