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    A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004::page 305
    Author:
    Sandeep S. Tonapi
    ,
    Sanjeev B. Sathe
    ,
    Bahgat G. Sammakia
    ,
    K. Srihari
    DOI: 10.1115/1.2351891
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages mounted in back-to-back and offset configurations. A cover plate is attached to the back side of the chips to enhance heat transfer from the module. The assembled organic carrier is placed in a vertical channel. A conjugate heat transfer model is used which accounts for conduction in the packages and the card and convection in the surrounding air. The effect of location of the modules on a card with zero, one and two power planes is evaluated for thermal performance. Heat dissipation is studied for forced convection (2, 1, and 0.5m∕s). Comparison is made for single sided and back-to-back cases.
    keyword(s): Heat , Temperature , Heat transfer , Air flow , Energy dissipation , Numerical analysis , Ball-Grid-Array packaging , Forced convection , Junctions , Temperature distribution , Convection AND Heat conduction ,
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      A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/133490
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    contributor authorSandeep S. Tonapi
    contributor authorSanjeev B. Sathe
    contributor authorBahgat G. Sammakia
    contributor authorK. Srihari
    date accessioned2017-05-09T00:19:30Z
    date available2017-05-09T00:19:30Z
    date copyrightDecember, 2006
    date issued2006
    identifier issn1528-9044
    identifier otherJEPAE4-26266#305_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133490
    description abstractThis paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages mounted in back-to-back and offset configurations. A cover plate is attached to the back side of the chips to enhance heat transfer from the module. The assembled organic carrier is placed in a vertical channel. A conjugate heat transfer model is used which accounts for conduction in the packages and the card and convection in the surrounding air. The effect of location of the modules on a card with zero, one and two power planes is evaluated for thermal performance. Heat dissipation is studied for forced convection (2, 1, and 0.5m∕s). Comparison is made for single sided and back-to-back cases.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
    typeJournal Paper
    journal volume128
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2351891
    journal fristpage305
    journal lastpage310
    identifier eissn1043-7398
    keywordsHeat
    keywordsTemperature
    keywordsHeat transfer
    keywordsAir flow
    keywordsEnergy dissipation
    keywordsNumerical analysis
    keywordsBall-Grid-Array packaging
    keywordsForced convection
    keywordsJunctions
    keywordsTemperature distribution
    keywordsConvection AND Heat conduction
    treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian