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contributor authorSandeep S. Tonapi
contributor authorSanjeev B. Sathe
contributor authorBahgat G. Sammakia
contributor authorK. Srihari
date accessioned2017-05-09T00:19:30Z
date available2017-05-09T00:19:30Z
date copyrightDecember, 2006
date issued2006
identifier issn1528-9044
identifier otherJEPAE4-26266#305_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133490
description abstractThis paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages mounted in back-to-back and offset configurations. A cover plate is attached to the back side of the chips to enhance heat transfer from the module. The assembled organic carrier is placed in a vertical channel. A conjugate heat transfer model is used which accounts for conduction in the packages and the card and convection in the surrounding air. The effect of location of the modules on a card with zero, one and two power planes is evaluated for thermal performance. Heat dissipation is studied for forced convection (2, 1, and 0.5m∕s). Comparison is made for single sided and back-to-back cases.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
typeJournal Paper
journal volume128
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2351891
journal fristpage305
journal lastpage310
identifier eissn1043-7398
keywordsHeat
keywordsTemperature
keywordsHeat transfer
keywordsAir flow
keywordsEnergy dissipation
keywordsNumerical analysis
keywordsBall-Grid-Array packaging
keywordsForced convection
keywordsJunctions
keywordsTemperature distribution
keywordsConvection AND Heat conduction
treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
contenttypeFulltext


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