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    Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002::page 157
    Author:
    C. Basaran
    ,
    D. Frear
    ,
    J. K. Lin
    ,
    H. Ye
    ,
    D. C. Hopkins
    DOI: 10.1115/1.1898338
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration and thermomigration, where void nucleation and growth contribute to the ultimate failure of the module. The Ni under bump metallization–solder joint interface is found to be the favorite site for void nucleation and growth. The effect of pre-existing voids on the failure mechanism of a solder joint is also investigated
    keyword(s): Nucleation (Physics) , Failure , Solder joints , Flip-chip , Electrodiffusion AND Current density ,
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      Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

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    http://yetl.yabesh.ir/yetl1/handle/yetl/131655
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    contributor authorC. Basaran
    contributor authorD. Frear
    contributor authorJ. K. Lin
    contributor authorH. Ye
    contributor authorD. C. Hopkins
    date accessioned2017-05-09T00:15:53Z
    date available2017-05-09T00:15:53Z
    date copyrightJune, 2005
    date issued2005
    identifier issn1528-9044
    identifier otherJEPAE4-26243#157_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131655
    description abstractThe failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration and thermomigration, where void nucleation and growth contribute to the ultimate failure of the module. The Ni under bump metallization–solder joint interface is found to be the favorite site for void nucleation and growth. The effect of pre-existing voids on the failure mechanism of a solder joint is also investigated
    publisherThe American Society of Mechanical Engineers (ASME)
    titleFailure Modes of Flip Chip Solder Joints Under High Electric Current Density
    typeJournal Paper
    journal volume127
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1898338
    journal fristpage157
    journal lastpage163
    identifier eissn1043-7398
    keywordsNucleation (Physics)
    keywordsFailure
    keywordsSolder joints
    keywordsFlip-chip
    keywordsElectrodiffusion AND Current density
    treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian