| contributor author | C. Basaran | |
| contributor author | D. Frear | |
| contributor author | J. K. Lin | |
| contributor author | H. Ye | |
| contributor author | D. C. Hopkins | |
| date accessioned | 2017-05-09T00:15:53Z | |
| date available | 2017-05-09T00:15:53Z | |
| date copyright | June, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26243#157_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131655 | |
| description abstract | The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration and thermomigration, where void nucleation and growth contribute to the ultimate failure of the module. The Ni under bump metallization–solder joint interface is found to be the favorite site for void nucleation and growth. The effect of pre-existing voids on the failure mechanism of a solder joint is also investigated | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Failure Modes of Flip Chip Solder Joints Under High Electric Current Density | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1898338 | |
| journal fristpage | 157 | |
| journal lastpage | 163 | |
| identifier eissn | 1043-7398 | |
| keywords | Nucleation (Physics) | |
| keywords | Failure | |
| keywords | Solder joints | |
| keywords | Flip-chip | |
| keywords | Electrodiffusion AND Current density | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002 | |
| contenttype | Fulltext | |
