contributor author | H. R. Ghorbani | |
contributor author | J. K. Spelt | |
date accessioned | 2017-05-09T00:15:52Z | |
date available | 2017-05-09T00:15:52Z | |
date copyright | September, 2005 | |
date issued | 2005 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26247#314_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131637 | |
description abstract | A two-dimensional model has been developed for the interfacial thermal stresses in short and long trilayer assemblies under both plane stress and plane strain conditions. Interfacial stresses are approximated using a combination of exact elasticity solutions and elementary strength of materials theories. Governing differential equations are linearized through a finite difference discretization procedure. The conditions of zero shear stress at the free edges and self-equilibrated peel stresses are satisfied. The approach is mathematically straightforward, can be extended to include inelastic behavior, and can be adapted to problems involving external loads and a variety of geometries. The results have been compared to available data in the literature and finite element analysis. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Interfacial Thermal Stresses in Trilayer Assemblies | |
type | Journal Paper | |
journal volume | 127 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1938205 | |
journal fristpage | 314 | |
journal lastpage | 323 | |
identifier eissn | 1043-7398 | |
keywords | Stress | |
keywords | Shear (Mechanics) | |
keywords | Manufacturing AND Plane strain | |
tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003 | |
contenttype | Fulltext | |