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    Interfacial Thermal Stresses in Trilayer Assemblies

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003::page 314
    Author:
    H. R. Ghorbani
    ,
    J. K. Spelt
    DOI: 10.1115/1.1938205
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A two-dimensional model has been developed for the interfacial thermal stresses in short and long trilayer assemblies under both plane stress and plane strain conditions. Interfacial stresses are approximated using a combination of exact elasticity solutions and elementary strength of materials theories. Governing differential equations are linearized through a finite difference discretization procedure. The conditions of zero shear stress at the free edges and self-equilibrated peel stresses are satisfied. The approach is mathematically straightforward, can be extended to include inelastic behavior, and can be adapted to problems involving external loads and a variety of geometries. The results have been compared to available data in the literature and finite element analysis.
    keyword(s): Stress , Shear (Mechanics) , Manufacturing AND Plane strain ,
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      Interfacial Thermal Stresses in Trilayer Assemblies

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/131637
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    contributor authorH. R. Ghorbani
    contributor authorJ. K. Spelt
    date accessioned2017-05-09T00:15:52Z
    date available2017-05-09T00:15:52Z
    date copyrightSeptember, 2005
    date issued2005
    identifier issn1528-9044
    identifier otherJEPAE4-26247#314_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131637
    description abstractA two-dimensional model has been developed for the interfacial thermal stresses in short and long trilayer assemblies under both plane stress and plane strain conditions. Interfacial stresses are approximated using a combination of exact elasticity solutions and elementary strength of materials theories. Governing differential equations are linearized through a finite difference discretization procedure. The conditions of zero shear stress at the free edges and self-equilibrated peel stresses are satisfied. The approach is mathematically straightforward, can be extended to include inelastic behavior, and can be adapted to problems involving external loads and a variety of geometries. The results have been compared to available data in the literature and finite element analysis.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleInterfacial Thermal Stresses in Trilayer Assemblies
    typeJournal Paper
    journal volume127
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1938205
    journal fristpage314
    journal lastpage323
    identifier eissn1043-7398
    keywordsStress
    keywordsShear (Mechanics)
    keywordsManufacturing AND Plane strain
    treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian