Show simple item record

contributor authorH. R. Ghorbani
contributor authorJ. K. Spelt
date accessioned2017-05-09T00:15:52Z
date available2017-05-09T00:15:52Z
date copyrightSeptember, 2005
date issued2005
identifier issn1528-9044
identifier otherJEPAE4-26247#314_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131637
description abstractA two-dimensional model has been developed for the interfacial thermal stresses in short and long trilayer assemblies under both plane stress and plane strain conditions. Interfacial stresses are approximated using a combination of exact elasticity solutions and elementary strength of materials theories. Governing differential equations are linearized through a finite difference discretization procedure. The conditions of zero shear stress at the free edges and self-equilibrated peel stresses are satisfied. The approach is mathematically straightforward, can be extended to include inelastic behavior, and can be adapted to problems involving external loads and a variety of geometries. The results have been compared to available data in the literature and finite element analysis.
publisherThe American Society of Mechanical Engineers (ASME)
titleInterfacial Thermal Stresses in Trilayer Assemblies
typeJournal Paper
journal volume127
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1938205
journal fristpage314
journal lastpage323
identifier eissn1043-7398
keywordsStress
keywordsShear (Mechanics)
keywordsManufacturing AND Plane strain
treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record