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    Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003::page 299
    Author:
    Ben Ting
    ,
    Vincent P. Manno
    DOI: 10.1115/1.1938206
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Laser hammering (LH) is a process used in the manufacturing of butterfly optoelectronic packages to correct laser-to-fiber misalignment that occurs when the semiconductor lasers are welded in place. High-power, precisely positioned pulsed lasers are used in LH to induce deformation of the fiber support housing to, in turn, induce realignment. A thermomechanical modeling study of LH is reported in this paper, which focuses on the degree to which a steady-state model can predict the asymptotic state of a transient response subjected to a periodic laser excitation. A baseline, two-dimensional fiber mounting/ferrule geometry is employed in a finite element analysis simulation case study. Various laser wave forms are applied to focus spot location sizes of 50 and 200μm over a range of applied heat fluxes (10–1000W∕mm2). Effects of laser energy deposition location, as well as the use of multiple lasers, are also studied. The results show that the steady-state solution is in good agreement with the asymptotic transient response for horizontal fiber displacement and fiber temperature. The laser focus spot surface temperature predictions are also found to be in reasonable agreement. However, the vertical fiber displacement tends to be overpredicted by the steady-state solution, sometimes by as much as an order of magnitude. The causes, both physical and computational, of this disagreement are discussed.
    keyword(s): Lasers , Fibers , Manufacturing , Temperature , Geometry , Displacement , Materials properties , Modeling AND Simulation ,
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      Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

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    http://yetl.yabesh.ir/yetl1/handle/yetl/131634
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    contributor authorBen Ting
    contributor authorVincent P. Manno
    date accessioned2017-05-09T00:15:52Z
    date available2017-05-09T00:15:52Z
    date copyrightSeptember, 2005
    date issued2005
    identifier issn1528-9044
    identifier otherJEPAE4-26247#299_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131634
    description abstractLaser hammering (LH) is a process used in the manufacturing of butterfly optoelectronic packages to correct laser-to-fiber misalignment that occurs when the semiconductor lasers are welded in place. High-power, precisely positioned pulsed lasers are used in LH to induce deformation of the fiber support housing to, in turn, induce realignment. A thermomechanical modeling study of LH is reported in this paper, which focuses on the degree to which a steady-state model can predict the asymptotic state of a transient response subjected to a periodic laser excitation. A baseline, two-dimensional fiber mounting/ferrule geometry is employed in a finite element analysis simulation case study. Various laser wave forms are applied to focus spot location sizes of 50 and 200μm over a range of applied heat fluxes (10–1000W∕mm2). Effects of laser energy deposition location, as well as the use of multiple lasers, are also studied. The results show that the steady-state solution is in good agreement with the asymptotic transient response for horizontal fiber displacement and fiber temperature. The laser focus spot surface temperature predictions are also found to be in reasonable agreement. However, the vertical fiber displacement tends to be overpredicted by the steady-state solution, sometimes by as much as an order of magnitude. The causes, both physical and computational, of this disagreement are discussed.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleTransient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing
    typeJournal Paper
    journal volume127
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1938206
    journal fristpage299
    journal lastpage305
    identifier eissn1043-7398
    keywordsLasers
    keywordsFibers
    keywordsManufacturing
    keywordsTemperature
    keywordsGeometry
    keywordsDisplacement
    keywordsMaterials properties
    keywordsModeling AND Simulation
    treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003
    contenttypeFulltext
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