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contributor authorBen Ting
contributor authorVincent P. Manno
date accessioned2017-05-09T00:15:52Z
date available2017-05-09T00:15:52Z
date copyrightSeptember, 2005
date issued2005
identifier issn1528-9044
identifier otherJEPAE4-26247#299_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131634
description abstractLaser hammering (LH) is a process used in the manufacturing of butterfly optoelectronic packages to correct laser-to-fiber misalignment that occurs when the semiconductor lasers are welded in place. High-power, precisely positioned pulsed lasers are used in LH to induce deformation of the fiber support housing to, in turn, induce realignment. A thermomechanical modeling study of LH is reported in this paper, which focuses on the degree to which a steady-state model can predict the asymptotic state of a transient response subjected to a periodic laser excitation. A baseline, two-dimensional fiber mounting/ferrule geometry is employed in a finite element analysis simulation case study. Various laser wave forms are applied to focus spot location sizes of 50 and 200μm over a range of applied heat fluxes (10–1000W∕mm2). Effects of laser energy deposition location, as well as the use of multiple lasers, are also studied. The results show that the steady-state solution is in good agreement with the asymptotic transient response for horizontal fiber displacement and fiber temperature. The laser focus spot surface temperature predictions are also found to be in reasonable agreement. However, the vertical fiber displacement tends to be overpredicted by the steady-state solution, sometimes by as much as an order of magnitude. The causes, both physical and computational, of this disagreement are discussed.
publisherThe American Society of Mechanical Engineers (ASME)
titleTransient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing
typeJournal Paper
journal volume127
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1938206
journal fristpage299
journal lastpage305
identifier eissn1043-7398
keywordsLasers
keywordsFibers
keywordsManufacturing
keywordsTemperature
keywordsGeometry
keywordsDisplacement
keywordsMaterials properties
keywordsModeling AND Simulation
treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003
contenttypeFulltext


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