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    Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004::page 466
    Author:
    B. L. Chen
    ,
    X. Q. Shi
    ,
    G. Y. Li
    ,
    K. H. Ang
    ,
    Jason P. Pickering
    DOI: 10.1115/1.2056574
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.
    keyword(s): Temperature , Reliability , Failure , Rapid tooling , Manufacturing , Solder joints , Testing , Ball-Grid-Array packaging AND Solders ,
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      Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/131609
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    • Journal of Electronic Packaging

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    contributor authorB. L. Chen
    contributor authorX. Q. Shi
    contributor authorG. Y. Li
    contributor authorK. H. Ang
    contributor authorJason P. Pickering
    date accessioned2017-05-09T00:15:50Z
    date available2017-05-09T00:15:50Z
    date copyrightDecember, 2005
    date issued2005
    identifier issn1528-9044
    identifier otherJEPAE4-26254#466_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131609
    description abstractIn this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleRapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly
    typeJournal Paper
    journal volume127
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2056574
    journal fristpage466
    journal lastpage473
    identifier eissn1043-7398
    keywordsTemperature
    keywordsReliability
    keywordsFailure
    keywordsRapid tooling
    keywordsManufacturing
    keywordsSolder joints
    keywordsTesting
    keywordsBall-Grid-Array packaging AND Solders
    treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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