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contributor authorB. L. Chen
contributor authorX. Q. Shi
contributor authorG. Y. Li
contributor authorK. H. Ang
contributor authorJason P. Pickering
date accessioned2017-05-09T00:15:50Z
date available2017-05-09T00:15:50Z
date copyrightDecember, 2005
date issued2005
identifier issn1528-9044
identifier otherJEPAE4-26254#466_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131609
description abstractIn this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.
publisherThe American Society of Mechanical Engineers (ASME)
titleRapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly
typeJournal Paper
journal volume127
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2056574
journal fristpage466
journal lastpage473
identifier eissn1043-7398
keywordsTemperature
keywordsReliability
keywordsFailure
keywordsRapid tooling
keywordsManufacturing
keywordsSolder joints
keywordsTesting
keywordsBall-Grid-Array packaging AND Solders
treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004
contenttypeFulltext


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