contributor author | Jeffrey Rambo | |
contributor author | Yogendra Joshi | |
date accessioned | 2017-05-09T00:15:50Z | |
date available | 2017-05-09T00:15:50Z | |
date copyright | December, 2005 | |
date issued | 2005 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26254#452_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131607 | |
description abstract | The optimal arrangement of various components in a standard data processing cabinet layout is investigated through computational fluid dynamics and heat transfer. Relevant heat transfer performance of candidate designs is measured by newly proposed metrics for systems level electronics cooling. The results are then extended to define a favorable power dissipation profile, the most favorable of which was found to be one where the power dissipation increases in the vertical direction. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet | |
type | Journal Paper | |
journal volume | 127 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2056575 | |
journal fristpage | 452 | |
journal lastpage | 459 | |
identifier eissn | 1043-7398 | |
keywords | Flow (Dynamics) | |
keywords | Temperature | |
keywords | Air flow | |
keywords | Entropy | |
keywords | Energy dissipation | |
keywords | Blades | |
keywords | Thermal resistance | |
keywords | Heat transfer | |
keywords | Turbulence | |
keywords | Computer cooling | |
keywords | Heat | |
keywords | Exhaust systems AND Design | |
tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004 | |
contenttype | Fulltext | |