YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

    Source: Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004::page 452
    Author:
    Jeffrey Rambo
    ,
    Yogendra Joshi
    DOI: 10.1115/1.2056575
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The optimal arrangement of various components in a standard data processing cabinet layout is investigated through computational fluid dynamics and heat transfer. Relevant heat transfer performance of candidate designs is measured by newly proposed metrics for systems level electronics cooling. The results are then extended to define a favorable power dissipation profile, the most favorable of which was found to be one where the power dissipation increases in the vertical direction.
    keyword(s): Flow (Dynamics) , Temperature , Air flow , Entropy , Energy dissipation , Blades , Thermal resistance , Heat transfer , Turbulence , Computer cooling , Heat , Exhaust systems AND Design ,
    • Download: (1.525Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/131607
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorJeffrey Rambo
    contributor authorYogendra Joshi
    date accessioned2017-05-09T00:15:50Z
    date available2017-05-09T00:15:50Z
    date copyrightDecember, 2005
    date issued2005
    identifier issn1528-9044
    identifier otherJEPAE4-26254#452_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131607
    description abstractThe optimal arrangement of various components in a standard data processing cabinet layout is investigated through computational fluid dynamics and heat transfer. Relevant heat transfer performance of candidate designs is measured by newly proposed metrics for systems level electronics cooling. The results are then extended to define a favorable power dissipation profile, the most favorable of which was found to be one where the power dissipation increases in the vertical direction.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet
    typeJournal Paper
    journal volume127
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2056575
    journal fristpage452
    journal lastpage459
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsTemperature
    keywordsAir flow
    keywordsEntropy
    keywordsEnergy dissipation
    keywordsBlades
    keywordsThermal resistance
    keywordsHeat transfer
    keywordsTurbulence
    keywordsComputer cooling
    keywordsHeat
    keywordsExhaust systems AND Design
    treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian