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contributor authorJeffrey Rambo
contributor authorYogendra Joshi
date accessioned2017-05-09T00:15:50Z
date available2017-05-09T00:15:50Z
date copyrightDecember, 2005
date issued2005
identifier issn1528-9044
identifier otherJEPAE4-26254#452_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131607
description abstractThe optimal arrangement of various components in a standard data processing cabinet layout is investigated through computational fluid dynamics and heat transfer. Relevant heat transfer performance of candidate designs is measured by newly proposed metrics for systems level electronics cooling. The results are then extended to define a favorable power dissipation profile, the most favorable of which was found to be one where the power dissipation increases in the vertical direction.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet
typeJournal Paper
journal volume127
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2056575
journal fristpage452
journal lastpage459
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsTemperature
keywordsAir flow
keywordsEntropy
keywordsEnergy dissipation
keywordsBlades
keywordsThermal resistance
keywordsHeat transfer
keywordsTurbulence
keywordsComputer cooling
keywordsHeat
keywordsExhaust systems AND Design
treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004
contenttypeFulltext


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