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    Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001::page 148
    Author:
    Xianjie Yang
    ,
    K. J. Lau
    ,
    C. L. Chow
    DOI: 10.1115/1.1649246
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, a semi-implicit time integration scheme has been developed for a damage-coupled constitutive model to characterize the mechanical behavior of 63Sn-37Pb solder material under thermo-mechanical fatigue (TMF) loading. The scheme is developed to provide an efficient numerical procedure of integration and iteration for calculating stress and other associated state variables within a strain-driven format. In particular, a novel Newton-Raphson iteration algorithm for the damage coupled constitutive material model involving von Mises viscoplastic potential function with nonlinear mixed hardening is formulated. An algorithmic tangent stiffness tensor is derived and the model is implemented numerically into a commercial finite element (FE) code ABAQUS through its user-defined material subroutine. Several numerical simulations are conducted for validation of the proposed algorithm.
    keyword(s): Solders , Stress , Algorithms , Constitutive equations , Computer simulation , Viscoplasticity , Tensors AND Hardening ,
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      Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/129905
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    • Journal of Electronic Packaging

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    contributor authorXianjie Yang
    contributor authorK. J. Lau
    contributor authorC. L. Chow
    date accessioned2017-05-09T00:12:46Z
    date available2017-05-09T00:12:46Z
    date copyrightMarch, 2004
    date issued2004
    identifier issn1528-9044
    identifier otherJEPAE4-26228#148_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129905
    description abstractIn this paper, a semi-implicit time integration scheme has been developed for a damage-coupled constitutive model to characterize the mechanical behavior of 63Sn-37Pb solder material under thermo-mechanical fatigue (TMF) loading. The scheme is developed to provide an efficient numerical procedure of integration and iteration for calculating stress and other associated state variables within a strain-driven format. In particular, a novel Newton-Raphson iteration algorithm for the damage coupled constitutive material model involving von Mises viscoplastic potential function with nonlinear mixed hardening is formulated. An algorithmic tangent stiffness tensor is derived and the model is implemented numerically into a commercial finite element (FE) code ABAQUS through its user-defined material subroutine. Several numerical simulations are conducted for validation of the proposed algorithm.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleTime Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
    typeJournal Paper
    journal volume126
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1649246
    journal fristpage148
    journal lastpage158
    identifier eissn1043-7398
    keywordsSolders
    keywordsStress
    keywordsAlgorithms
    keywordsConstitutive equations
    keywordsComputer simulation
    keywordsViscoplasticity
    keywordsTensors AND Hardening
    treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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