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contributor authorXianjie Yang
contributor authorK. J. Lau
contributor authorC. L. Chow
date accessioned2017-05-09T00:12:46Z
date available2017-05-09T00:12:46Z
date copyrightMarch, 2004
date issued2004
identifier issn1528-9044
identifier otherJEPAE4-26228#148_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129905
description abstractIn this paper, a semi-implicit time integration scheme has been developed for a damage-coupled constitutive model to characterize the mechanical behavior of 63Sn-37Pb solder material under thermo-mechanical fatigue (TMF) loading. The scheme is developed to provide an efficient numerical procedure of integration and iteration for calculating stress and other associated state variables within a strain-driven format. In particular, a novel Newton-Raphson iteration algorithm for the damage coupled constitutive material model involving von Mises viscoplastic potential function with nonlinear mixed hardening is formulated. An algorithmic tangent stiffness tensor is derived and the model is implemented numerically into a commercial finite element (FE) code ABAQUS through its user-defined material subroutine. Several numerical simulations are conducted for validation of the proposed algorithm.
publisherThe American Society of Mechanical Engineers (ASME)
titleTime Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
typeJournal Paper
journal volume126
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1649246
journal fristpage148
journal lastpage158
identifier eissn1043-7398
keywordsSolders
keywordsStress
keywordsAlgorithms
keywordsConstitutive equations
keywordsComputer simulation
keywordsViscoplasticity
keywordsTensors AND Hardening
treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001
contenttypeFulltext


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