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    The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001::page 106
    Author:
    Thomas D. Moore
    ,
    John L. Jarvis
    DOI: 10.1115/1.1649240
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The peeling stress near the free edge of a bimaterial beam under uniform temperature change creates a moment which causes both layers to have identical curvatures at the interface. A new formula from beam theory is given for this Peeling Moment. A beam with a negative Peeling Moment resists delamination at the free edge. A physical explanation for the moment is developed; the sign of the Peeling Moment is also the determinant of the location of the equivalent centroid of the bimaterial beam. This provides a valuable new rule for designing resistance to thermomechanical delamination of a bimaterial structure.
    keyword(s): Electrical resistance , Stress , Delamination , Temperature AND Design ,
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      The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies

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    http://yetl.yabesh.ir/yetl1/handle/yetl/129897
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    contributor authorThomas D. Moore
    contributor authorJohn L. Jarvis
    date accessioned2017-05-09T00:12:46Z
    date available2017-05-09T00:12:46Z
    date copyrightMarch, 2004
    date issued2004
    identifier issn1528-9044
    identifier otherJEPAE4-26228#106_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129897
    description abstractThe peeling stress near the free edge of a bimaterial beam under uniform temperature change creates a moment which causes both layers to have identical curvatures at the interface. A new formula from beam theory is given for this Peeling Moment. A beam with a negative Peeling Moment resists delamination at the free edge. A physical explanation for the moment is developed; the sign of the Peeling Moment is also the determinant of the location of the equivalent centroid of the bimaterial beam. This provides a valuable new rule for designing resistance to thermomechanical delamination of a bimaterial structure.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies
    typeJournal Paper
    journal volume126
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1649240
    journal fristpage106
    journal lastpage109
    identifier eissn1043-7398
    keywordsElectrical resistance
    keywordsStress
    keywordsDelamination
    keywordsTemperature AND Design
    treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian