contributor author | Thomas D. Moore | |
contributor author | John L. Jarvis | |
date accessioned | 2017-05-09T00:12:46Z | |
date available | 2017-05-09T00:12:46Z | |
date copyright | March, 2004 | |
date issued | 2004 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26228#106_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129897 | |
description abstract | The peeling stress near the free edge of a bimaterial beam under uniform temperature change creates a moment which causes both layers to have identical curvatures at the interface. A new formula from beam theory is given for this Peeling Moment. A beam with a negative Peeling Moment resists delamination at the free edge. A physical explanation for the moment is developed; the sign of the Peeling Moment is also the determinant of the location of the equivalent centroid of the bimaterial beam. This provides a valuable new rule for designing resistance to thermomechanical delamination of a bimaterial structure. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | The Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies | |
type | Journal Paper | |
journal volume | 126 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1649240 | |
journal fristpage | 106 | |
journal lastpage | 109 | |
identifier eissn | 1043-7398 | |
keywords | Electrical resistance | |
keywords | Stress | |
keywords | Delamination | |
keywords | Temperature AND Design | |
tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001 | |
contenttype | Fulltext | |