Show simple item record

contributor authorThomas D. Moore
contributor authorJohn L. Jarvis
date accessioned2017-05-09T00:12:46Z
date available2017-05-09T00:12:46Z
date copyrightMarch, 2004
date issued2004
identifier issn1528-9044
identifier otherJEPAE4-26228#106_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129897
description abstractThe peeling stress near the free edge of a bimaterial beam under uniform temperature change creates a moment which causes both layers to have identical curvatures at the interface. A new formula from beam theory is given for this Peeling Moment. A beam with a negative Peeling Moment resists delamination at the free edge. A physical explanation for the moment is developed; the sign of the Peeling Moment is also the determinant of the location of the equivalent centroid of the bimaterial beam. This provides a valuable new rule for designing resistance to thermomechanical delamination of a bimaterial structure.
publisherThe American Society of Mechanical Engineers (ASME)
titleThe Peeling Moment–A Key Rule for Delamination Resistance in I.C. Assemblies
typeJournal Paper
journal volume126
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1649240
journal fristpage106
journal lastpage109
identifier eissn1043-7398
keywordsElectrical resistance
keywordsStress
keywordsDelamination
keywordsTemperature AND Design
treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record