contributor author | Y. Wei | |
contributor author | H. E. Fang | |
contributor author | T. J. Lim | |
contributor author | W. Lu | |
contributor author | M. K. Neilsen | |
contributor author | C. L. Chow | |
date accessioned | 2017-05-09T00:12:46Z | |
date available | 2017-05-09T00:12:46Z | |
date copyright | March, 2004 | |
date issued | 2004 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26228#100_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129896 | |
description abstract | The effects of specimen geometry size on the behavior of 63Sn-37Pb solder are investigated both experimentally in the laboratory and analytically with finite-element simulations. The simulations are achieved by developing a constitutive model for solder which couples viscoplasticity with a unified damage theory. The unified damage theory is characterized by a damage surface in strain space which separates fatigue damage from inelastic damage. The damage evolution equations are derived within the framework of irreversible thermodynamics. A series of uniaxial tension, tensile creep, and strain-controlled fatigue experiments are performed to obtain material parameters for the solder damage model. The solder damage model is then implemented into a finite element code and used to simulate a uniaxial tension test on a miniature specimen and on a standard ASTM specimen (ASTM Standards, 1999, “Tension Testing of Metallic Materials,” ASTM E8-78). Predictions from these simulations are then compared with each other and with experimental results in order to examine microstructure size effects. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Failure Analysis of Miniature Solder Specimen | |
type | Journal Paper | |
journal volume | 126 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1648060 | |
journal fristpage | 100 | |
journal lastpage | 105 | |
identifier eissn | 1043-7398 | |
keywords | Solders | |
keywords | Equations | |
keywords | Failure analysis | |
keywords | Constitutive equations | |
keywords | Tension | |
keywords | Finite element analysis | |
keywords | Stress | |
keywords | Fatigue damage | |
keywords | Computer simulation | |
keywords | Creep | |
keywords | Fatigue | |
keywords | Geometry | |
keywords | ASTM International AND Irreversible thermodynamics | |
tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001 | |
contenttype | Fulltext | |