| contributor author | Chandrakant S. Desai | |
| contributor author | Russell Whitenack | |
| contributor author | Tribikram Kundu | |
| contributor author | Zhichao Wang | |
| date accessioned | 2017-05-09T00:12:44Z | |
| date available | 2017-05-09T00:12:44Z | |
| date copyright | June, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26233#225_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129870 | |
| description abstract | For realistic design, reliability and failure analysis of materials such as solders for problems in electronic packaging, it is essential to develop and validate appropriate constitutive models. Such models should include effect of important factors such as elastic, plastic and creep behavior, microcracking leading to fracture and failure, and cyclic mechanical and thermal loading including rate, dwell time, and amplitude. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Testing and Modeling of Solders Using New Test Device, Part 1: Models and Testing | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1756146 | |
| journal fristpage | 225 | |
| journal lastpage | 231 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Testing | |
| keywords | Stress | |
| keywords | Modeling | |
| keywords | Constitutive equations AND Fracture (Process) | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 002 | |
| contenttype | Fulltext | |