contributor author | Y. Wei | |
contributor author | K. J. Lau | |
contributor author | P. Vianco | |
contributor author | H. E. Fang | |
contributor author | C. L. Chow | |
date accessioned | 2017-05-09T00:12:42Z | |
date available | 2017-05-09T00:12:42Z | |
date copyright | September, 2004 | |
date issued | 2004 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26235#367_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129858 | |
description abstract | This paper presents an investigation of lead-free Sn-Ag base alloy, 95.5Sn-3.9Ag-0.6Cu, both experimentally and analytically. Experimentally, the deformation behavior of the material was measured for different temperatures (25°C and 1000°C) over a range of strain rates (10−5 to 10−3/s) under isothermal and thermomechanical conditions. Development of a unified viscoplastic constitutive model followed, taking into account the effects of the measured strain rate and temperature changes. The temperature rate effects are considered in the evolution equation of back stress. In order to include material degradation in the solder, the theory of damage mechanics is applied by introducing two damage variables in the viscoplastic constitutive model. Finally, the constitutive model is coded into a general-purpose finite element computer program (ABAQUS) through its user-defined material subroutine (UMAT). The damage-coupled finite element analysis (FEA) is then employed to monitor the condition of failure of a notched component. The predicted and measured maximum loads have been compared and found to be satisfactory. In addition, the calculated damage distribution contours enable the identification of potential failure site for failure analysis. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Behavior of Lead-Free Solder Under Thermomechanical Loading | |
type | Journal Paper | |
journal volume | 126 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1773197 | |
journal fristpage | 367 | |
journal lastpage | 373 | |
identifier eissn | 1043-7398 | |
keywords | Temperature | |
keywords | Alloys | |
keywords | Solders | |
keywords | Stress | |
keywords | Constitutive equations | |
keywords | Finite element analysis | |
keywords | Equations | |
keywords | Failure | |
keywords | Lead-free solders | |
keywords | Deformation | |
keywords | Materials degradation | |
keywords | Computer software AND Failure analysis | |
tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003 | |
contenttype | Fulltext | |