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    Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004::page 510
    Author:
    Roger Schmidt
    ,
    Ethan Cruz
    DOI: 10.1115/1.1827266
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper focuses on the effect on rack inlet air temperatures as a result of maldistribution of airflows exiting the perforated tiles located adjacent to the fronts of the racks. The flow distribution exiting the perforated tiles was generated from a computational fluid dynamics (CFD) tool called Tileflow (trademark of Innovative Research, Inc.). Both raised floor heights and perforated tile-free areas were varied in order to explore the effect on rack inlet temperatures. The flow distribution exiting the perforated tiles was used as boundary conditions to the above-floor CFD model. A CFD model was generated for the room with electronic equipment installed on a raised floor. Forty racks of data processing (DP) equipment were arranged in rows in a data center cooled by chilled air exhausting from perforated floor tiles. The chilled air was provided by four A/C units placed inside a room 12.1 m wide×13.4 m long. Because the arrangement of the racks in the data center was symmetric, only half of the data center was modeled. The numerical modeling for the area above the raised floor was performed using a commercially available finite control volume computer code called Flotherm (trademark of Flomerics, Inc.). The flow was modeled using the k-e turbulence model. Results are displayed to provide some guidance on the design and layout of a data center.
    keyword(s): Flow (Dynamics) , Temperature , Data centers , Tiles AND Computers ,
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      Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

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    http://yetl.yabesh.ir/yetl1/handle/yetl/129835
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    contributor authorRoger Schmidt
    contributor authorEthan Cruz
    date accessioned2017-05-09T00:12:41Z
    date available2017-05-09T00:12:41Z
    date copyrightDecember, 2004
    date issued2004
    identifier issn1528-9044
    identifier otherJEPAE4-26239#510_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129835
    description abstractThis paper focuses on the effect on rack inlet air temperatures as a result of maldistribution of airflows exiting the perforated tiles located adjacent to the fronts of the racks. The flow distribution exiting the perforated tiles was generated from a computational fluid dynamics (CFD) tool called Tileflow (trademark of Innovative Research, Inc.). Both raised floor heights and perforated tile-free areas were varied in order to explore the effect on rack inlet temperatures. The flow distribution exiting the perforated tiles was used as boundary conditions to the above-floor CFD model. A CFD model was generated for the room with electronic equipment installed on a raised floor. Forty racks of data processing (DP) equipment were arranged in rows in a data center cooled by chilled air exhausting from perforated floor tiles. The chilled air was provided by four A/C units placed inside a room 12.1 m wide×13.4 m long. Because the arrangement of the racks in the data center was symmetric, only half of the data center was modeled. The numerical modeling for the area above the raised floor was performed using a commercially available finite control volume computer code called Flotherm (trademark of Flomerics, Inc.). The flow was modeled using the k-e turbulence model. Results are displayed to provide some guidance on the design and layout of a data center.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleCluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
    typeJournal Paper
    journal volume126
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1827266
    journal fristpage510
    journal lastpage518
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsTemperature
    keywordsData centers
    keywordsTiles AND Computers
    treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian