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contributor authorRoger Schmidt
contributor authorEthan Cruz
date accessioned2017-05-09T00:12:41Z
date available2017-05-09T00:12:41Z
date copyrightDecember, 2004
date issued2004
identifier issn1528-9044
identifier otherJEPAE4-26239#510_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129835
description abstractThis paper focuses on the effect on rack inlet air temperatures as a result of maldistribution of airflows exiting the perforated tiles located adjacent to the fronts of the racks. The flow distribution exiting the perforated tiles was generated from a computational fluid dynamics (CFD) tool called Tileflow (trademark of Innovative Research, Inc.). Both raised floor heights and perforated tile-free areas were varied in order to explore the effect on rack inlet temperatures. The flow distribution exiting the perforated tiles was used as boundary conditions to the above-floor CFD model. A CFD model was generated for the room with electronic equipment installed on a raised floor. Forty racks of data processing (DP) equipment were arranged in rows in a data center cooled by chilled air exhausting from perforated floor tiles. The chilled air was provided by four A/C units placed inside a room 12.1 m wide×13.4 m long. Because the arrangement of the racks in the data center was symmetric, only half of the data center was modeled. The numerical modeling for the area above the raised floor was performed using a commercially available finite control volume computer code called Flotherm (trademark of Flomerics, Inc.). The flow was modeled using the k-e turbulence model. Results are displayed to provide some guidance on the design and layout of a data center.
publisherThe American Society of Mechanical Engineers (ASME)
titleCluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
typeJournal Paper
journal volume126
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1827266
journal fristpage510
journal lastpage518
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsTemperature
keywordsData centers
keywordsTiles AND Computers
treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004
contenttypeFulltext


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