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    On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002::page 235
    Author:
    Alfonso Ortega
    ,
    Shankar Ramanathan
    DOI: 10.1115/1.1569507
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A model for uniform parallel flow over the surface of a rectangular source of heat on a conducting plate is used to demonstrate the use of analytic Green’s functions to formulate the conjugate problem. The Green’s functions are solutions to the temperature field that arises from a point source of heat on the surface. They provide a relationship between the local heat flux and surface temperature on the plate, effectively serving the same role as the heat transfer coefficient. By coupling the pointwise Green’s function to a finite element discretization of the thin plate, the surface temperature and convective heat flux distributions on the heat source and its substrate are found by a non-iterative procedure. A parametric study shows that at high Peclet numbers, the heat transfer from the source approaches the behavior of an infinite two-dimensional source of heat. The average Nusselt numbers for rectangular sources of different aspect ratios are found to be insensitive to source aspect ratio at high Peclet numbers. Board conduction reduces the average Nusselt numbers over the source when it is defined in terms of the freestream temperature. New correlations for the source Nusselt number as a function of flow Peclet number and board conductivity are presented.
    keyword(s): Flow (Dynamics) , Heat , Temperature , Heat transfer , Cooling , Fluids , Heat conduction , Forced convection , Conductivity , Equations , Functions , Electronic components , Convection , Heat flux , Heat transfer coefficients , Diffusion (Physics) AND Finite element analysis ,
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      On the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate

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    http://yetl.yabesh.ir/yetl1/handle/yetl/128228
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    • Journal of Electronic Packaging

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    contributor authorAlfonso Ortega
    contributor authorShankar Ramanathan
    date accessioned2017-05-09T00:09:54Z
    date available2017-05-09T00:09:54Z
    date copyrightJune, 2003
    date issued2003
    identifier issn1528-9044
    identifier otherJEPAE4-26218#235_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128228
    description abstractA model for uniform parallel flow over the surface of a rectangular source of heat on a conducting plate is used to demonstrate the use of analytic Green’s functions to formulate the conjugate problem. The Green’s functions are solutions to the temperature field that arises from a point source of heat on the surface. They provide a relationship between the local heat flux and surface temperature on the plate, effectively serving the same role as the heat transfer coefficient. By coupling the pointwise Green’s function to a finite element discretization of the thin plate, the surface temperature and convective heat flux distributions on the heat source and its substrate are found by a non-iterative procedure. A parametric study shows that at high Peclet numbers, the heat transfer from the source approaches the behavior of an infinite two-dimensional source of heat. The average Nusselt numbers for rectangular sources of different aspect ratios are found to be insensitive to source aspect ratio at high Peclet numbers. Board conduction reduces the average Nusselt numbers over the source when it is defined in terms of the freestream temperature. New correlations for the source Nusselt number as a function of flow Peclet number and board conductivity are presented.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleOn the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate
    typeJournal Paper
    journal volume125
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1569507
    journal fristpage235
    journal lastpage243
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsHeat
    keywordsTemperature
    keywordsHeat transfer
    keywordsCooling
    keywordsFluids
    keywordsHeat conduction
    keywordsForced convection
    keywordsConductivity
    keywordsEquations
    keywordsFunctions
    keywordsElectronic components
    keywordsConvection
    keywordsHeat flux
    keywordsHeat transfer coefficients
    keywordsDiffusion (Physics) AND Finite element analysis
    treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian