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contributor authorAlfonso Ortega
contributor authorShankar Ramanathan
date accessioned2017-05-09T00:09:54Z
date available2017-05-09T00:09:54Z
date copyrightJune, 2003
date issued2003
identifier issn1528-9044
identifier otherJEPAE4-26218#235_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128228
description abstractA model for uniform parallel flow over the surface of a rectangular source of heat on a conducting plate is used to demonstrate the use of analytic Green’s functions to formulate the conjugate problem. The Green’s functions are solutions to the temperature field that arises from a point source of heat on the surface. They provide a relationship between the local heat flux and surface temperature on the plate, effectively serving the same role as the heat transfer coefficient. By coupling the pointwise Green’s function to a finite element discretization of the thin plate, the surface temperature and convective heat flux distributions on the heat source and its substrate are found by a non-iterative procedure. A parametric study shows that at high Peclet numbers, the heat transfer from the source approaches the behavior of an infinite two-dimensional source of heat. The average Nusselt numbers for rectangular sources of different aspect ratios are found to be insensitive to source aspect ratio at high Peclet numbers. Board conduction reduces the average Nusselt numbers over the source when it is defined in terms of the freestream temperature. New correlations for the source Nusselt number as a function of flow Peclet number and board conductivity are presented.
publisherThe American Society of Mechanical Engineers (ASME)
titleOn the Use of Point Source Solutions for Forced Air Cooling of Electronic Components—Part II: Conjugate Forced Convection From a Discrete Rectangular Source on a Thin Conducting Plate
typeJournal Paper
journal volume125
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1569507
journal fristpage235
journal lastpage243
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsHeat
keywordsTemperature
keywordsHeat transfer
keywordsCooling
keywordsFluids
keywordsHeat conduction
keywordsForced convection
keywordsConductivity
keywordsEquations
keywordsFunctions
keywordsElectronic components
keywordsConvection
keywordsHeat flux
keywordsHeat transfer coefficients
keywordsDiffusion (Physics) AND Finite element analysis
treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002
contenttypeFulltext


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