| contributor author | Avram Bar-Cohen | |
| contributor author | Madhusudan Iyengar | |
| contributor author | Allan D. Kraus | |
| date accessioned | 2017-05-09T00:09:54Z | |
| date available | 2017-05-09T00:09:54Z | |
| date copyright | June, 2003 | |
| date issued | 2003 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26218#208_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128224 | |
| description abstract | The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Design of Optimum Plate-Fin Natural Convective Heat Sinks | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1568361 | |
| journal fristpage | 208 | |
| journal lastpage | 216 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat | |
| keywords | Heat transfer | |
| keywords | Energy dissipation | |
| keywords | Design | |
| keywords | Optimization | |
| keywords | Heat sinks | |
| keywords | Heat transfer coefficients AND Fins | |
| tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002 | |
| contenttype | Fulltext | |