Show simple item record

contributor authorAvram Bar-Cohen
contributor authorMadhusudan Iyengar
contributor authorAllan D. Kraus
date accessioned2017-05-09T00:09:54Z
date available2017-05-09T00:09:54Z
date copyrightJune, 2003
date issued2003
identifier issn1528-9044
identifier otherJEPAE4-26218#208_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128224
description abstractThe effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.
publisherThe American Society of Mechanical Engineers (ASME)
titleDesign of Optimum Plate-Fin Natural Convective Heat Sinks
typeJournal Paper
journal volume125
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1568361
journal fristpage208
journal lastpage216
identifier eissn1043-7398
keywordsHeat
keywordsHeat transfer
keywordsEnergy dissipation
keywordsDesign
keywordsOptimization
keywordsHeat sinks
keywordsHeat transfer coefficients AND Fins
treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record