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    Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002::page 268
    Author:
    Hung-Lung Lee
    ,
    Francis Su
    ,
    S. K. Chen
    ,
    Shyang-Jye Chang
    ,
    Sheng-Jye Hwang
    DOI: 10.1115/1.1569957
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing variability, which implies optimal quality. A mold-flow simulation tool called C-MOLD is used to evaluate various design configurations. Taguchi’s robust design method is used for manufacturing variability considerations. The simulated results are verified with experimental flow patterns produced by means of “short shots.” In the nomenclature of the Taguchi method, mold-flow balance was chosen as quality characteristics and select a set of design parameters called control factors. The objectives are to find the levels of the control factors, which optimize the flow balance, and, at the same time, minimize the sensitivity of the variations of the control factors.
    keyword(s): Flow (Dynamics) , Design , Design methodology , Packaging , Taguchi methods , Manufacturing , Computer-aided design , Simulation , Equations AND Cavities ,
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      Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/128210
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    • Journal of Electronic Packaging

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    contributor authorHung-Lung Lee
    contributor authorFrancis Su
    contributor authorS. K. Chen
    contributor authorShyang-Jye Chang
    contributor authorSheng-Jye Hwang
    date accessioned2017-05-09T00:09:53Z
    date available2017-05-09T00:09:53Z
    date copyrightJune, 2003
    date issued2003
    identifier issn1528-9044
    identifier otherJEPAE4-26218#268_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128210
    description abstractThis paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing variability, which implies optimal quality. A mold-flow simulation tool called C-MOLD is used to evaluate various design configurations. Taguchi’s robust design method is used for manufacturing variability considerations. The simulated results are verified with experimental flow patterns produced by means of “short shots.” In the nomenclature of the Taguchi method, mold-flow balance was chosen as quality characteristics and select a set of design parameters called control factors. The objectives are to find the levels of the control factors, which optimize the flow balance, and, at the same time, minimize the sensitivity of the variations of the control factors.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleComputer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance
    typeJournal Paper
    journal volume125
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1569957
    journal fristpage268
    journal lastpage275
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsDesign
    keywordsDesign methodology
    keywordsPackaging
    keywordsTaguchi methods
    keywordsManufacturing
    keywordsComputer-aided design
    keywordsSimulation
    keywordsEquations AND Cavities
    treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002
    contenttypeFulltext
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