contributor author | Hung-Lung Lee | |
contributor author | Francis Su | |
contributor author | S. K. Chen | |
contributor author | Shyang-Jye Chang | |
contributor author | Sheng-Jye Hwang | |
date accessioned | 2017-05-09T00:09:53Z | |
date available | 2017-05-09T00:09:53Z | |
date copyright | June, 2003 | |
date issued | 2003 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26218#268_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128210 | |
description abstract | This paper presents a methodology for TSOP II LOC packaging design. The design objectives are: 1) to optimize mold-flow balance, which in turn minimizes air traps, and 2) to minimize manufacturing variability, which implies optimal quality. A mold-flow simulation tool called C-MOLD is used to evaluate various design configurations. Taguchi’s robust design method is used for manufacturing variability considerations. The simulated results are verified with experimental flow patterns produced by means of “short shots.” In the nomenclature of the Taguchi method, mold-flow balance was chosen as quality characteristics and select a set of design parameters called control factors. The objectives are to find the levels of the control factors, which optimize the flow balance, and, at the same time, minimize the sensitivity of the variations of the control factors. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance | |
type | Journal Paper | |
journal volume | 125 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1569957 | |
journal fristpage | 268 | |
journal lastpage | 275 | |
identifier eissn | 1043-7398 | |
keywords | Flow (Dynamics) | |
keywords | Design | |
keywords | Design methodology | |
keywords | Packaging | |
keywords | Taguchi methods | |
keywords | Manufacturing | |
keywords | Computer-aided design | |
keywords | Simulation | |
keywords | Equations AND Cavities | |
tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002 | |
contenttype | Fulltext | |